Dipl.-Ing. Leonhard Kunz

E-Mail: leonhard.kunz(at)rptu.de

Phone: +49 631 20575-7009

Room: 42-267

Summary

Leonhard Kunz studied mechanical engineering with a specialization in energy technology at the TU Kaiserslautern. In his diploma thesis, he worked on a simulative approach to training data generation for AI-controlled robot grasping. He joined the Chair of Machine Tools and Controls in January 2025. 

Research Fields

In his research, Leonhard Kunz focuses on the use of federated learning in industrial applications, with a particular emphasis on the use of vision language models for processing 2D design data. 

 

Publications 

Kunz, L., Reif, M., Petzsche, T., Schmallenbach, A., Plociennik, C., Ruskowski, M. (2024). Realizing Closed-Loop Supply Chain Networks based on Dataspaces and Manufacturing Marketplaces. IFAC-PapersOnLine, 58(19), 235-240. DOI: 10.1016/j.ifacol.2024.09.177 

Klostermeier, M., Kunz, L., Motsch, W., Ioshchikhes, B., Plociennik, C., Ruskowski, M. (2024). Energy Load Profile Analysis and Application for Production Simulation and Scheduling using Energy Load Disaggregation. In INFORMATIK 2024 (pp. 1079-1097). Gesellschaft für Informatik eV. DOI: 10.18420/inf2024_97 

Richard, P., Dudhagara, S. U., Kunz, L., Plociennik, C., Ruskowski, M. (2024). Autonomous mobile robot search strategy for automated compressed air leakage detection. In INFORMATIK 2024 (pp. 1099-1111). Gesellschaft für Informatik eV. DOI: 10.18420/inf2024_98 

Blumhofer, B., Weigand, J., Kunz, L., Rübel, P., Wagner, A. (2023, September). Detection of Rare Fault Cases for Mobile Robot Applications. In European Symposium on Artificial Intelligence in Manufacturing (pp. 61-70). Cham: Springer Nature Switzerland. DOI: 10.1007/978-3-031-57496-2_7 

Rimaz, M. H., Plociennik, C., Kunz, L., Ruskowski, M. (2023, September). Am I in good shape? Flexible way to validate asset administration shell data entry via shapes constraint language. In 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA) (pp. 1-6). IEEE. DOI: 10.1109/ETFA54631.2023.10275629